Maryland's Defense Patent Database

The defense community in Maryland is an R&D powerhouse.

Use this database to see the innovative patents that are poised for commercialization.

Wafer bonding of thinned electronic materials and circuits to high performance substrate

Patent image
NRL

A method of bonding a wafer to a substrate comprising the steps of: providing a wafer having a front surface and a back surface; attaching the front surface of the wafer to a support; thinning the wafer from the back surface; bonding the back surface of the wafer to a substrate using a thin bonding technique; and removing the support from the front surface of the wafer. A circuit comprising: a substrate; and a wafer; wherein the wafer is at most about 50 microns thick; wherein the wafer has a front surface comprising features; and wherein the wafer has a back surface bonded to the substrate using a thin bonding technique.

Inventors: 
Kub, Francis; Hobart, Karl
Patent Number: 
Technical domain: 
Materials and Coatings
FIle Date: 
2005-11-22
Grant Date: 
2008-04-15
Grant time: 
875 days
Grant time percentile rank: 
16
Claim count percentile rank: 
7
Citations percentile rank: 
1
'Cited by' percentile rank: 
2
Assignee: 
US NAVY