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Hybrid thin film heterostructure modular vibration control apparatus and methods for fabrication thereof

Patent image
ARL

Microelectromechanical systems (MEMS) include critical devices for various highly sensitive applications. However, MEMS operation may be impaired by vibration. A modular vibration control pedestal for integration with a MEMS is provided according to embodiments of the present invention which includes a piezoelectric perovskite oxide disposed on a substrate and a shape memory alloy component component disposed on the piezoelectric perovskite oxide. In particular embodiments of a MEMS device including a modular VCP, vibration is reduced by at least 50%.

Inventors: 
Cole, Melanie W.; Nothwang, William
Patent Number: 
Technical domain: 
Mechanical and Fluid Systems
FIle Date: 
2007-09-28
Grant Date: 
2009-05-05
Grant time: 
585 days
Grant time percentile rank: 
10
Claim count percentile rank: 
6
Citations percentile rank: 
2
'Cited by' percentile rank: 
1
Assignee: 
US ARMY