Maryland's Defense Patent Database

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Wafer bonding of thinned electronic materials and circuits to high performance substrates

Patent image
NRL

A method of bonding a wafer to a substrate comprising the steps of: providing a wafer having a front surface and a back surface; attaching the front surface of the wafer to a support; thinning the wafer from the back surface; bonding the back surface of the wafer to a substrate using a thin bonding technique; and removing the support from the front surface of the wafer. A circuit comprising: a substrate; and a wafer; wherein the wafer is at most about 50 microns thick; wherein the wafer has a front surface comprising features; and wherein the wafer has a back surface bonded to the substrate using a thin bonding technique.

Inventors: 
Kub, Francis J.; Hobart, Karl D.
Patent Number: 
Technical domain: 
Materials and Coatings
FIle Date: 
2003-05-20
Grant Date: 
2009-05-19
Grant time: 
2,191 days
Grant time percentile rank: 
40
Claim count percentile rank: 
4
Citations percentile rank: 
1
'Cited by' percentile rank: 
3
Assignee: 
US NAVY