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Self-assembled electrical contacts

Patent image
CCDC ARL

Self-assembling microscale electrical and mechanical connections includes a part binding site and a part electrical binding site; and a template binding site comprising a template electrical conductor layer; a metallization layer on the template electrical conductor layer; a bump structure comprising a solder alloy positioned on the metallization layer, wherein the solder alloy is liquefied to allow the bump structure to self-assemble and align with the part electrical binding site using capillary forces, and wherein the solder alloy only liquefies at a temperature above that at which the self-assembly and alignment is performed; and a fluid on the template electrical conductor layer, wherein the fluid comprises a melting point lower than that of the solder alloy, wherein the fluid binds with the part binding site.

Inventors: 
Morris, Christopher J.; Dubey, Mandan
Patent Number: 
Technical domain: 
Communications
FIle Date: 
2009-11-24
Grant Date: 
2012-11-27
Grant time: 
1,099 days
Grant time percentile rank: 
20
Claim count percentile rank: 
2
Citations percentile rank: 
1
'Cited by' percentile rank: 
1
Assignee: 
US ARMY